Ieee Std 80 2013 Instant

8.1 Allowable touch voltage 8.2 Allowable step voltage 8.3 Reduction factors (e.g., crushed rock surface layer)

4.1 Objectives of grounding 4.2 Tolerable body current limits 4.3 Effect of frequency on body impedance 4.4 Criteria for tolerable touch and step voltages ieee std 80 2013

7.1 Conductor material and corrosion 7.2 Thermal capacity 7.3 Mechanical strength 7.4 Conductor size calculations (based on fusion temperature) ieee std 80 2013

11.1 Alternative methods (deep-driven rods, counterpoise, chemical rods) 11.2 Surface layer improvements ieee std 80 2013

6.1 Division of fault current between grid and neutral 6.2 Asymmetrical current factor (decrement factor) 6.3 Current split factor (grid current vs. remote earth)

9.1 Preliminary grid design 9.2 Resistance of grounding grid 9.3 Maximum grid current (I G ) 9.4 Mesh voltage (E m ) calculation (Sverak's method) 9.5 Step voltage (E s ) calculation 9.6 Voltage gradient distribution 9.7 Refinement of grid design (iterative process)

5.1 Design parameters 5.2 Fault current considerations 5.3 Fault duration 5.4 Soil resistivity 5.5 Resistivity measurement techniques (Wenner four-pin method) 5.6 Crushed rock surface layer resistivity